View MPXV2010GP_1282984.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Freescale Semiconductor Technical Data
MPX2010 Rev 11, 11/2006
10 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors
The MPX2010/MPXV2010G series silicon piezoresistive pressure sensors provide a very accurate and linear voltage output directly proportional to the applied pressure. These sensors house a single monolithic silicon die with the strain gauge and thin film resistor network integrated on each chip. The sensor is laser trimmed for precise span, offset calibration and temperature compensation. Features * Temperature Compensated over 0C to +85C * Ratiometric to Supply Voltage * Differential and Gauge Options Typical Applications * Respiratory Diagnostics * Air Movement Control * Controllers * Pressure Switching ORDERING INFORMATION
Device Type Ported Elements Options Case No. MPX Series Order No. MPXV2010GP MPXV2010DP Packing Options Trays Trays Device Marking MPXV2010G MPXV2010G
MPX2010 MPXV2010G SERIES
COMPENSATED PRESSURE SENSOR 0 to 10 kPa (0 to 1.45 psi) FULL SCALE SPAN: 25 mV
SMALL OUTLINE PACKAGES
MPXV2010GP CASE 1369-01
MPXV2010DP CASE 1351-01
SMALL OUTLINE PACKAGE (MPXV2010G SERIES) Gauge, Side Port, SMT Differential, Dual Port, SMT Basic Element Ported Elements Differential Differential, Dual Port Gauge Gauge, Axial Gauge, Axial PC Mount 1369 1351
SMALL OUTLINE PACKAGE PIN NUMBERS
1 2 3 4 GND(1) +VOUT VS -VOUT 5 6 7 8 N/C N/C N/C N/C
UNIBODY PACKAGE (MPX2010 SERIES) 344 344C 344B 344E 344F MPX2010D MPX2010DP MPX2010GP MPX2010GS MPX2010GSX -- -- -- -- -- MPX2010D MPX2010DP
1. Pin 1 in noted by the notch in the lead.
UNIBODY PACKAGE PIN NUMBERS
MPX2010GP MPX2010D MPX2010D 1 2 GND(1) +VOUT 3 4 VS -VOUT
1. Pin 1 in noted by the notch in the lead.
UNIBODY PACKAGES
MPX2010GP CASE 344-15
MPX2010GP CASE 344B-01
MPX2010DP CASE 344C-01
MPX2010GS CASE 344E-01
MPX2010GSX CASE 344F-01
(c) Freescale Semiconductor, Inc., 2006. All rights reserved.
VS 3 Thin Film Temperature Compensation and Calibration Circuitry 1 GND
2 4
Sensing Element
+VOUT -VOUT
Figure 1. Temperature Compensated and Calibrated Pressure Sensor Schematic
VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE
The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip.
Table 1. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol PMAX TSTG TA Value 75 -40 to +125 -40 to +125 Unit kPa C C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX2010 2 Sensors Freescale Semiconductor
Table 2. Operating Characteristics (VS = 10 VDC, TA = 25C unless otherwise noted, P1 > P2)
Characteristic Pressure Range(1) Supply Voltage Supply Current Full Scale Span Offset(4) Sensitivity Linearity(5) Pressure Hysteresis
(5) (3) (2)
Symbol POP VS IO VFSS VOFF V/ --
Min 0 -- -- 24 -1.0 -- -1.0 -- -- -1.0 -1.0 1000 1400 -- -- --
Typ -- 10 6.0 25 -- 2.5 -- 0.1 0.5 -- -- -- -- 1.0 2.0 0.5
Max 10 16 -- 26 1.0 -- 1.0 -- -- 1.0 1.0 2550 3000 -- -- --
Units kPa VDC mAdc mV mV mV/kPa %VFSS %VFSS %VFSS %VFSS mV W W ms ms %VFSS
(0 to 50 kPa)
-- -- TCVFSS TCVOFF ZIN ZOUT
Temperature Hysteresis(5) (-40C to +125C) Temperature Effect on Full Scale Span Temperature Effect on Offset(5) Input Impedance Output Impedance Response Time Warm-Up Time Offset Stability(7)
(6) (5)
(10% to 90%)
tR -- --
1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum related pressure. 4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX2010 Sensors Freescale Semiconductor 3
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION
VS = 10 Vdc TA = 25C P1 > P2 TYP
a
30 25 20 Output (mVdc) 15 10 5 0 -5 kPa PSI
MAX
Span Range (Typical) MIN
2.5 0.362
5 0.725
7.5 1.09
10 1.45
Offset (Typical)
Figure 2. Output vs. Pressure Differential Figure 2 shows the output characteristics of the MPX2010/ MPXV2010G series at 25C. The output is directly proportional to the differential pressure and is essentially a straight line. The effects of temperature on full scale span and offset are very small and are shown under Operating Characteristics. This performance over temperature is achieved by having both the shear stress strain gauge and the thin-film resistor circuitry on the same silicon diaphragm. Each chip is dynamically laser trimmed for precise span and offset calibration and temperature compensation.
Silicone Die Coat Wire Bond
Die P1
Stainless Steel Metal Cover Epoxy Case
Lead Frame P2
RTV Die Bond
Figure 3. Unibody Package: Cross Sectional Diagram (Not to Scale) Figure 3 illustrates the differential/gauge die in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2010/MPXV2010G series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application.
MPX2010 4 Sensors Freescale Semiconductor
LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 4) or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure.
Least Squares Fit Exaggerated Performance Curve Least Square Deviation Straight Line Deviation
Relative Voltage Output
End Point Straight Line Fit
Offset 0 50 Pressure (% Full Scale) 100
Figure 4. Linearity Specification Comparison
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Freescale MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table. Table 3. Pressure (P1) Side Delineation
Part Number MPX2010D MPX2010DP MPX2010GP MPX2010GS MPX2010GSX MPXV2010GP MPXV2010DP Case Type 344 344C 344B 344E 344F 1369 1351 Pressure (P1) Side Identifier Stainless Steep Cap Side with Part Marking Side with Port Attached Side with Port Attached Side with Port Attached Side with Port Attached Side with Part Marking
MPX2010 Sensors Freescale Semiconductor 5
PACKAGE DIMENSIONS
C R M
1
B
-AN
PIN 1
1234
2
3
4
Z
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
DIM A B C D F G J L M N R Y Z INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30 NOM 30 NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00
L
-TJ
SEATING PLANE
G F
M
F Y
D 4 PL 0.136 (0.005)
TA
M
DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL
STYLE 1: PIN 1. 2. 3. 4.
GROUND + OUTPUT + SUPPLY - OUTPUT
STYLE 2: PIN 1. 2. 3. 4.
VCC - SUPPLY + SUPPLY GROUND
STYLE 3: PIN 1. 2. 3. 4.
GND -VOUT VS +VOUT
CASE 344-15 ISSUE AA UNIBODY PACKAGE
SEATING PLANE
-TR H N
PORT #1 POSITIVE PRESSURE (P1)
-AU L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC
-Q-
B
12 34
PIN 1
K
S
-P0.25 (0.010) J C
M
TQ
S
F G D 4 PL 0.13 (0.005)
M
TS
S
Q
S
STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT
CASE 344B-01 ISSUE B UNIBODY PACKAGE
MPX2010 6 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
V R
PORT #2 PORT #1
-AU W H N
PORT #2 VACUUM (P2)
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38
PORT #1 POSITIVE PRESSURE (P1)
-QSEATING PLANE
B
SEATING PLANE
PIN 1
1234
-P-TJ C -T0.25 (0.010)
M
K S
TQ
S
F G D 4 PL
0.13 (0.005)
M
TS
S
Q
S
STYLE 1: PIN 1. 2. 3. 4.
GROUND + OUTPUT + SUPPLY - OUTPUT
CASE 344C-01 ISSUE B UNIBODY PACKAGE
PORT #1 POSITIVE PRESSURE (P1)
C
BACK SIDE VACUUM (P2)
A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D F G J K N R S V INCHES MILLIMETERS MIN MAX MIN MAX 0.690 0.720 17.53 18.28 0.245 0.255 6.22 6.48 0.780 0.820 19.81 20.82 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.345 0.375 8.76 9.53 0.300 0.310 7.62 7.87 0.178 0.186 4.52 4.72 0.220 0.240 5.59 6.10 0.182 0.194 4.62 4.93 STYLE 1: PIN 1. 2. 3. 4.
-B-
V
43 21 PIN 1
K J R
SEATING PLANE
S G F D 4 PL 0.13 (0.005)
M
N
-T-
TB
M
GROUND + OUTPUT + SUPPLY - OUTPUT
CASE 344E-01 ISSUE B UNIBODY PACKAGE
MPX2010 Sensors Freescale Semiconductor 7
PACKAGE DIMENSIONS
-TC E A U -Q-
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MIN MAX MIN MAX 1.080 1.120 27.43 28.45 0.740 0.760 18.80 19.30 0.630 0.650 16.00 16.51 0.016 0.020 0.41 0.51 0.160 0.180 4.06 4.57 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.220 0.240 5.59 6.10 0.070 0.080 1.78 2.03 0.150 0.160 3.81 4.06 0.150 0.160 3.81 4.06 0.440 0.460 11.18 11.68 0.695 0.725 17.65 18.42 0.840 0.860 21.34 21.84 0.182 0.194 4.62 4.92
V
N R
PORT #1 POSITIVE PRESSURE (P1)
B
-P0.25 (0.010)
M
PIN 1
TQ
M
4
3
2
1
S K
J
F D 4 PL 0.13 (0.005)
G
STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (-) OUT
M
TP
S
Q
S
CASE 344F-01 ISSUE B UNIBODY PACKAGE
MPX2010 8 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE1351-01 ISSUE A SMALL OUTLINE PACKAGE
MPX2010 Sensors Freescale Semiconductor 9
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE1351-01 ISSUE A SMALL OUTLINE PACKAGE
MPX2010 10 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE
MPX2010 Sensors Freescale Semiconductor 11
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE
MPX2010 12 Sensors Freescale Semiconductor
NOTES
MPX2010 Sensors Freescale Semiconductor 13
How to Reach Us:
Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com
Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2006. All rights reserved.
MPX2010 Rev. 11 11/2006

▲Up To Search▲

Price & Availability of MPXV2010GP

	To Download MPXV2010GP Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .